| 一种新颖的Ka频段T/R组件立体混合集成封装 |
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| 引用本文： | 何毅龙.一种新颖的Ka频段T/R组件立体混合集成封装[J].电讯技术,2012,52(7):1160-1163. |
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| 作者姓名： | 何毅龙 |
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| 作者单位： | 中国西南电子技术研究所,成都,610036 |
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| 摘 要： | 介绍了一种新颖的Ka频段T/R组件立体混合集成封装.针对Ka频段T/R组件高频率和高密度的特点,提出了一种新颖的多层组装和双面密封的立体电路结构,采用软基片、FR-4等简单成熟工艺,实现了Ka频段M- MCM的混合集成.该封装具有集成度高、散热性好和可靠性高等特点,能够应用于Ka频段二维有源相控阵T/R子阵的工程研制.
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| 关 键 词： | Ka频段 有源相控阵 T/R组件 立体混合集成封装 |
A novel 3D compound-integrated packaging of Ka-band T/R module |
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| HE Yi-long.A novel 3D compound-integrated packaging of Ka-band T/R module[J].Telecommunication Engineering,2012,52(7):1160-1163. |
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| Authors: | HE Yi-long |
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| Institution: | HE Yi-long(Southwest China Institute of Electronic Technology,Chengdu 610036,China) |
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| Abstract: | A 3D compound-integrated packaging of Ka-band T/R module is described in this paper.According to the high frequency and high density features of the Ka-band T/R module,a novel multilayer-assembled and double-sided-sealing 3D circuit-structure is provided.By adopting some simple manufacturing methods such as soft-substrate and FR-4,the compound-integrated Ka-band Multifunction Multi-chip Module(M-MCM) is realized.The packaging is featured by high integration,good heat dissipation and high reliability and can be applied in the engineering development of the Ka-band Adaptive Phase Array Radar(APAR) T/R subarray. |
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| Keywords: | Ka-band adaptive phase array radar T/R module 3D compound-integrated packaging |
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