One-step electrodeposition process to fabricate cathodic superhydrophobic surface

In this work, a rapid one-step process is developed to fabricate superhydrophobic cathodic surface by electrodepositing copper plate in an electrolyte solution containing manganese chloride (MnCl₂·4H₂O), myristic acid (CH₃(CH₂)₁₂COOH) and ethanol. The superhydrophobic surfaces were characterized by means of scanning electron microscopy (SEM), and Fourier transform infrared spectroscopy (FTIR) and X-ray diffraction (XRD). The shortest electrolysis time for fabricating a superhydrophobic surface is about 1 min, the measured maximum contact angle is 163° and rolling angle is less than 3°. Furthermore, this method can be easily extended to other conductive materials. The approach is time-saving and cheap, and it is supposed to have a promising future in industrial fields.