微纳米尺度膜/基结构界面性能的实验研究

为了研究铜膜/有机玻璃结构的界面性能,首先对沉积在有机玻璃基底上300nm厚的铜膜进行了单轴压缩实验,部分区域的薄膜因屈曲而脱离基底。选择在膜/基粘接良好区域、膜/基脱粘区域分别进行等位移纳米压痕实验。利用膜/基粘接良好区域处硬度/弹性模量与压痕位移的关系来确定膜/基结构的临界脱粘位移。基于宏观力学中表征界面性能的能量法,利用两个区域等位移的塑性功差值来确定界面能量释放率。研究结果表明:当压痕位移约450nm时,膜/基结构开始出现界面脱粘,实验测得铜膜/有机玻璃结构的界面能量释放率值在6.81~10.32J/m2之间。

Experimental Investigation on Interfacial Properties of Micro-Nano Scale Film/Substrate Structure

In order to study the interfacial properties of Cu/PMMA structure, uniaxial compression experiment of copper film deposited on a PMMA substrate with thickness of 300nm was performed. Part of film was detached from the substrate due to buckling. Equal displacement nanoindentation experiment was performed in film/substrate bonding well region and film/substrate delaminated region, respectively. Critical debonding displacement of film/substrate structure was determined based on the relation between hardness/elastic modulus and indention displacement obtained from film/substrate bonding well region. Based on the energy method for interfacial property characterization in macromechanics, the difference between equal displacement plastic work from two regions was adopted to determine the interfacial energy release rate. Results show that when indention depth reachs about 450nm, the film/ substrate structure began to debond. The measured interfacial energy release rate of Cu/PMMA structure is in the range of 6.81~10.32J/m².