Chemical bath deposition of CdS channel layer for fabrication of low temperature-processed thin-film-transistors

～66 nm thick CdS film with a hexagonal structure was uniformly generated via a low temperature-processed chemical bath deposition at 80 °C using a complexing agent of ethylenediaminetetraacetic acid and its crystal structure, surface morphology, optical transmittance, and Raman scattering property were measured. Grown CdS film was used as a channel layer for the fabrication of bottom-gate, top-contact thin-film-transistor (TFT). The TFT device with 60 °C-dried channel layer exhibited a poor electrical performance of on-to-off drain current ratio (I_on/I_off) of 5.1 × 10³ and saturated channel mobility (μ_sat) of 0.10 cm²/Vs. However, upon annealing at 350 °C, substantially improved electrical characteristics resulted, showing I_on/I_off of 5.9 × 10⁷ and μ_sat of 5.07 cm²/Vs. Furthermore, CdS channel layer was chemically deposited in an identical way on a transparent substrate of SiN_x/ITO/glass as part of transparent TFT fabrication, resulting in I_on/I_off of 5.8 × 10⁷ and μ_sat of 2.50 cm²/Vs.