| 新一代无铅兼容PCB基板的研究进展（Ⅱ） |
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| 引用本文： | 张家亮.新一代无铅兼容PCB基板的研究进展（Ⅱ）[J].覆铜板资讯,2006(3):12-16,32. |
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| 作者姓名： | 张家亮 |
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| 作者单位： | 南美覆铜板厂有限公司 |
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| 摘 要： | 本文回顾了环氧树脂用酚醛树脂固化剂的历史．介绍了无铅兼容PCB基板的两种主要的酚醛树脂固化剂。比较了酚醛固化环氧和双氰胺固化环氧的板材性能。分析了酚醛固化剂对覆铜板对CAF性能的影响，同时，评析了区分板材是否元铅兼容的技术手段和标准。列举了当前典型的新一代元铅兼容PCB基板的产品性能。
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| 关 键 词： | 元铅焊料 PCB基板 兼容 可靠性 绿色 进展 |
PROGRESS OF RESEARCH IN THE NEXT GENERATION LEAD FREE COMPATIBLE PCB SUBSTRATE |
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| Authors: | ZHANG Jia-liang |
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| Institution: | Nanmei Copper Clad Laminate Factory Ltd., Foshan Guangdong 528231, China |
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| Abstract: | In the paper, the history of phenolic cure agent used in epoxy was reviewed. Two main phenolic cure agent of lead free compatible PCB substrate were introduced. Performance of substrate cured with different curing system was compared. The effect of cure agent to conductive anodic filament (CAF) performance of copper clad laminate was analyzed. At the same, technology and standard about discerning lead free compatible substrate were overviewed. The typical product of next generation lead free compatible PCB substrate was exemplified. |
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| Keywords: | lead free solder PCB substrate compatible the next generation reliability green progress |
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