| 电镀前工艺对MLCC电镀后质量的影响 |
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| 引用本文： | 王志纯,王晓莉,姚熹.电镀前工艺对MLCC电镀后质量的影响[J].电子元件与材料,1999,18(2):1-2. |
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| 作者姓名： | 王志纯 王晓莉 姚熹 |
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| 作者单位： | 西安交通大学电子材料研究所,西安,710049 |
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| 基金项目： | “863”计划新材料领域资助 |
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| 摘 要： | 在相同电镀条件下，对不同银端浆、不同材料体系的ＭＬＣＣ进行电镀，实验结果表明，它们的镀后合格率不一样。总的来讲，１类瓷的镀后合格率要高于２类瓷的合格率，高温烧结的ＭＬＣＣ的镀后合格率要高于低温烧结的ＭＬＣＣ。端电极银底层的质量对于镀后ＭＬＣＣ的产品合格率有很大的影响，用扫描电镜观察发现如果银底层不致密或有针孔，将导致镀后ＭＬＣＣ的损耗超出合格标准。
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| 关 键 词： | 多层瓷介电容器 三层端电极 电镀 瓷料体系 银端浆 |
| 修稿时间： | 1998-08-02 |
Effect of the processes before plating on the plated MLCC's |
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| Wang Zhichun,Wang Xiaoli,Yao Xi.Effect of the processes before plating on the plated MLCC''''s[J].Electronic Components & Materials,1999,18(2):1-2. |
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| Authors: | Wang Zhichun Wang Xiaoli Yao Xi |
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| Abstract: | Under the same plating conditions, MLCC's made from different ceramic materials are
plated with different silver paste terminals The experimental results show that after plating, the
yield of Class I MLLC's is higher than that of Class II and the yield of the MLLC's sintered at high
temperature high than that of those sintered at low temperature SEM results show that pinholes
in silver electrode layers will deteriorate DF of plated MLCC's (1 ref ) |
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| Keywords: | MLCC's trilayer electrodes eletroplating ceramics silver paste for terminals |
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