The relationship between the macroscopic properties of PECVD silicon nitride and oxynitride layers and the characteristics of their networks

Silicon nitride and oxynitride films have been deposited on silicon wafers using plasma-enhanced chemical vapour deposition. Various amounts of ammonia, silane and nitrous oxide gases were applied at fixed total gas flow and at the same deposition temperature. The dependence of the macroscopic properties of the layers such as refractive index, internal stress and etch rate on the reaction atmosphere during deposition has been demonstrated. The chemical structure of amorphous layers was studied using infrared spectroscopy. The network was found to be characterised by SiN_xO_yH_z tetrahedra, joined to each other by common corners. The characteristic vibrational bands due to species that join tetrahedral units (N(-Si≡)₃, ≡Si-N-Si≡, ≡Si-O-Si≡) and species that stop this interconnection (Si-H, N-H) were determined and discussed with reference to the corresponding species available during deposition. The analysis resulted in the determination of the relationship between the chemical structure of the network and the layer’s refractive index, internal stress and etch rate. Received: 24 July 2000 / Accepted: 30 May 2001 / Published online: 30 August 2001