一种适用于超宽带通信的微带垂直转换结构

该文提出一种适用于超宽带电路的基于过孔的微带垂直转换结构。通过在过孔附近的电源层上蚀刻平面电磁带隙单元来抑制电源分配网络谐振，降低其在过孔处的自阻抗，以改善垂直互连结构传输性能。将互连结构分解为过孔处耦合的微带线结构和电源平面对结构，并使用网络分析方法快速估算系统传输性能。仿真和实验测试表明，在3.1-10.6 GHz的超宽带频段内过孔的插入损耗小于0.4 dB。与在电源分配网络之间添加短路过孔方法相比，该结构在传输性能相当的前提下减少了一个布线层，从而降低了设备成本。

Design of Microstrip Vertical Transition in Multilayered Printed Circuit Board for Ultra Wide-band Communication

A new microstrip vertical transition based on the via in multilayered printed circuit board is proposed for Ultra Wide-Band(UWB) communication.The planar electromagnetic band-gap unit is etched on power plane around the vias to suppress resonance and reduce self impedance of the Power Distribution Network(PDN),and then transmission performance is improved.The interconnect structure is decoupled into microstrip mode and power ground pair mode which coupled in the vias.The network analysis method is used to estimate system performance efficiently.The simulated and measured results show that the proposed transition has an insertion loss of <0.4 dB across the frequency band 3.1-10.6 GHz.By comparison with the method of adding shorting vias between PDN,the proposed structure in this paper benefits of low cost for one less routing layer with considerable performance.