Intergranular and transgranular crack growth at triple junction boundaries in ordered intermetallics |
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| Institution: | 1. National Center for Electron Microscopy in Beijing, Key Laboratory of Advanced Materials (MOE), State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China;2. Central Iron and Steel Research Institute, Beijing 100081, China;1. School of Mechanical and Power Engineering, East China University of Science and Technology, 130 Meilong Road, Shanghai 200237, China;2. Department of Mechanical Engineering, University of Alberta, 10-203 Donadeo Innovation Centre for Engineering, Edmonton, Alberta T6G 1H9, Canada;1. College of Material Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, P R China;2. School of Metallurgy and Materials Engineering, Jiangsu University of Science and Technology, Zhangjiagang 215600, P R China;3. Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing 100124, P R China;4. Jiangsu Collaborative Innovation Center for Advanced Inorganic Function Composites, Nanjing 210016, P R China |
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| Abstract: | Coincident site-lattice (CSL) and random grain boundaries (GBs) effects on intergranular and transgranular crack propagation paths in ordered intermetallics that are subjected to high rates of strain are investigated. A three dimensional dislocation density based multiple slip crystalline formulation and computational scheme are used for a detailed understanding and accurate characterization of interrelated deformation and failure mechanisms that can occur due to the generation, trapping, interaction, and annihilation of mobile and immobile dislocation densities that are generally associated with finite strain high strain-rate plasticity in L12 ordered intermetallics. Results from this study indicate that intergranular crack growth is along the GBs, normal to the stress-axis, and is due to the dominance of normal stresses in the crack-tip region. Transgranular crack growth is along slip-planes, and is due to the dominance of shear stresses in the crack-tip region. |
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