Layer-by-layer deposition of Ti-4,4′-oxydianiline hybrid thin films

Features of the two thin-film techniques, atomic layer deposition (ALD) and molecular layer deposition (MLD), are combined to build up a stable novel inorganic-organic hybrid material of the (-Ti-N-C₆H₄-O-C₆H₄-N-)_n type, deposited from successive pulses of TiCl₄ and 4,4′-oxydianiline precursors. Depositions in the temperature range of 160-230 °C resulted in unstable films, while the films obtained in the temperature range of 250-490 °C were found stable in atmospheric air. The growth rate increased with increasing temperature, from 0.3 Å per cycle at 160 °C to 1.1 Å per cycle at 490 °C.