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Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503 K to 673 K |
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| Authors: | Likun Zang Zhangfu YuanHongyan Xu Bingsheng Xu |
| Affiliation: | a Department of Chemistry, School of Chemical and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China b Department of Energy and Resources Engineering, College of Engineering, Peking University, Beijing 100871, China |
| Abstract: | |
| Keywords: | Pb-free solder Sessile drop method Contact angle Electronic materials |
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