Flaw-to-grain echo enhancement by split-spectrum processing |
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Authors: | V.L. Newhouse N.M. Bilgutay J. Saniie E.S. Furgason |
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Affiliation: | School of Electrical Engineering, Purdue University, Lafayette, Indiana, USA |
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Abstract: | A split-spectrum processing technique for an ultrasonic flaw detection system has been developed which improves the flaw-to-grain echo ratio in large-grained materials. The enhancement is achieved by partitioning a wide-band received spectrum to obtain frequency shifted bands, which are then processed to suppress the grain echoes with respect to the flaw echo, using a novel signal minimization algorithm. Experimental data for titanium and stainless steel samples are presented which show superior flaw detection capabilities for the minimization algorithm with respect to frequency averaging techniques. |
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Keywords: | ultrasonic testing clutter reduction signal processing |
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