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Flaw-to-grain echo enhancement by split-spectrum processing
Authors:VL Newhouse  NM Bilgutay  J Saniie  ES Furgason
Institution:School of Electrical Engineering, Purdue University, Lafayette, Indiana, USA
Abstract:A split-spectrum processing technique for an ultrasonic flaw detection system has been developed which improves the flaw-to-grain echo ratio in large-grained materials. The enhancement is achieved by partitioning a wide-band received spectrum to obtain frequency shifted bands, which are then processed to suppress the grain echoes with respect to the flaw echo, using a novel signal minimization algorithm. Experimental data for titanium and stainless steel samples are presented which show superior flaw detection capabilities for the minimization algorithm with respect to frequency averaging techniques.
Keywords:ultrasonic testing  clutter reduction  signal processing
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