Molecular dynamics simulations of reactive etching of SiC by energetic fluorine |
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Authors: | F Gou LZT Chen C Meng Q Qian |
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Institution: | (1) School of Computer Science and Technology, 550025 Guizhou Province, P.R. China;(2) School of Electronic Science and Information Technology, 550025 Guizhou Province, P.R. China |
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Abstract: | Molecular dynamics simulations were performed to investigate F continuously bombarding Si-terminated 3C-SiC(001) surfaces
with incident energies of 10, 100 and 200 eV at normal incidence and room temperature. For an energy of 10 eV, deposition
only occurs on the surface. For energies larger than 10 eV, accompanying the saturation of F uptake, a balance between F deposition
from the incident atoms and F removal from the fluorinated substrate is established, while the steady-state etching is reached.
The simulated results demonstrate that Si atoms in SiC are preferentially etched, which is in good agreement with experiments.
The preferential etching of Si results in formation of a C-rich interfacial layer whose thickness increases with increasing
incident energy. The analysis shows that Si-containing etch products are dominant.
PACS 52.65.Yy; 81.65.Cf; 52.77.Dq |
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Keywords: | |
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