| 导热环氧树脂灌封料的研制 |
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| 引用本文： | 朱永明,庄胜坤.导热环氧树脂灌封料的研制[J].电子工艺技术,1997,18(6):231-233,236. |
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| 作者姓名： | 朱永明 庄胜坤 |
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| 作者单位： | 电子部第十四研究所 |
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| 摘 要： | 导热灌封料研制的重点是在导热性，绝缘性，除此之外，同时还要考虑工艺性等，显然，在这些性能中，导热性与绝缘性，耐开裂性与耐热性这两对矛盾的特性要兼容在技术上还是比较困难的，文中的目标是它们之间取得适当的平衡。
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| 关 键 词： | 灌封料 电子元器件 环氧树脂 导热性 |
Development of Heat Conducting Epoxy Resin Sealing Material |
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| Zhu Yongming,Zhuang Shengkun.Development of Heat Conducting Epoxy Resin Sealing Material[J].Electronics Process Technology,1997,18(6):231-233,236. |
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| Authors: | Zhu Yongming Zhuang Shengkun |
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| Institution: | Zhu Yongming Zhuang Shengkun |
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| Abstract: | The stress of developing heat conducting sealing material is heat conduction and insulation,as well as technology,heat-resistance,split-resistance and so on.It is quite evident that these tow contradiction of heat conduction and insulation,split-resistance and heat-resistance need compatible in these characteristics,but it is still more difficult in technology.The objective of the article is to make proper balance among them. |
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| Keywords: | Sealing material Electronic component |
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