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A decoupled modal analysis for nonlinear dynamics of an orthotropic thin laminate in a simply supported boundary condition subject to thermal mechanical loading
Authors:Xiaoling He  
Institution:aUniversity of Wisconsin–Milwaukee, 3200 N. Cramer Street, P.O. Box 784, Milwaukee, WI 53201, United States
Abstract:In this paper, we analyze the nonlinear dynamic response of an orthotropic laminate in a simply supported boundary condition subject to thermal and mechanical loading. The equation of motion for the laminate’s deflection is obtained in a decoupled Duffing equation by means of a Galerkin-type method without Berger’s approximations. The Duffing equation incorporates an arbitrary thermal field, with both the in-plane and transverse temperature variations in a steady-state and a transient state. The formulation indicates that the transverse temperature variation produces an additional pressure load, while the in-plane temperature variation affects the system frequency. The equation allows for characterization of the laminate behaviors in nonlinear thermal buckling, thermal vibration and thermal mechanical response.
Keywords:Laminate nonlinear dynamics  Nonlinear thermal buckling and vibration  Chaos  Duffing equation
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