| 环氧树脂及其增强材料回顾 |
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| 引用本文： | 张伯兴.环氧树脂及其增强材料回顾[J].印制电路信息,2004(5):14-20,28. |
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| 作者姓名： | 张伯兴 |
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| 作者单位： | 江南计算技术研究所,213084 |
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| 摘 要： | 本文回顾了PCB制造常用的环氧树脂及其增强材料的性能和用途。同时,还介绍了代用树脂材料和代用增强材料的最新进展,如改性环氧树脂、无卤树脂、Thermount、PTFE、氰酸酯等,并就其性能进行了探讨。
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| 关 键 词： | PCB 环氧树脂 玻璃布 增强材料 介电常数 介电损耗 |
A Review and Prospect of Resin Material and Reinforcements |
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| Zhang Boxing.A Review and Prospect of Resin Material and Reinforcements[J].Printed Circuit Information,2004(5):14-20,28. |
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| Authors: | Zhang Boxing |
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| Institution: | Zhang Boxing |
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| Abstract: | In this paper, the performance and use of the epoxy material and reinforcements usually used in PCB manufacturing process are reviewed. Meanwhile, the latest progress of the alternative resins and alternative reinforcements, such as modified epoxy, halogen-free resins, Cyanate, PTFE, Thermount, and so on, are introduced .And the performances are also discussed. |
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| Keywords: | PCB epoxy woven-glass-cloth reinforcements dielectric constant dissipation factor |
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