Thermal shock fracture of a crack in a functionally gradient half-space based on the memory-dependent heat conduction model |
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| Institution: | 1. College of Pipeline and Civil Engineering, China University of Petroleum (East China), Qingdao 266580, China;2. State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi''an Jiaotong University, Xi''an 710049, China;1. State Key Laboratory of Structural Analysis for Industrial Equipment, International Research Center for Computational Mechanics, Dalian University of Technology, Dalian 116024, China;2. Shanghai Electro-Mechanical Engineering Institute, Shanghai 201109, China;1. Faculty of Science and Technology, Laboratory of Mechanics and Civil Engineering, Tangier, Morocco;2. Centro de Astrobiología (CSIC-INTA), Instituto Nacional de Técnica Aeroespacial, Torrejón de Ardoz, Madrid, Spain |
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| Abstract: | In the present study, we consider a thermoelastic half-space made of a functionally gradient material with an insulated crack, which is subjected to a thermal impact. The memory-dependent heat conduction model is adopted for analysis. By using the Fourier and Laplace transforms, the thermoelastic problem is formulated in terms of singular integral equations which can be solved numerically. Effects of the time delay, kernel function, and nonhomogeneity parameters on the temperature and stress intensity factor are analyzed. Our results are also compared with those based on the Fourier and CV heat conduction models, which can be viewed as two special cases of the present model. In conclusion, the memory-dependent derivative and nonhomogeneity parameters play an essential role in controlling the heat transfer process. |
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