| QFP结构中引脚焊缝界面端的奇异性热应力问题研究 |
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| 引用本文： | 平学成,陈梦成,应少军.QFP结构中引脚焊缝界面端的奇异性热应力问题研究[J].固体力学学报,2011(Z1). |
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| 作者姓名： | 平学成 陈梦成 应少军 |
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| 作者单位： | 华东交通大学机电学院; |
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| 基金项目： | 国家自然科学基金项目(1066200451065008); 江西省自然科学基金项目(2010GZW0013); 江西省教育厅科研项目(GJJ10444)资助 |
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| 摘 要： | 由于引脚、印制电路板和焊接剂的热-机材料属性不同,在受到热载荷或机械载荷时,引脚焊接界面端会产生奇异性应力,有可能产生界面开裂.为了基于界面端奇异场来评价QFP结构引脚界面端力学行为,本文拟采用数值方法求解引脚焊缝任意角度尖劈界面端的应力强度系数.具体步骤为:首先,基于高次内插有限元特征分析法确定两相任意角度尖劈界面端的奇异性指数和应力角分布函数,并引入常数热应力项,获得热-机耦合奇异性应力场表达式;采用有限元分析技术和最小二乘拟合法来获得应力强度系数的数值解.文中考察了热-机材料属性对热载荷下焊接剂/印制电路板界面端应力强度系数的影响,并给出改善界面端热应力状态的建议.
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| 关 键 词： | 印制电路板 界面端 应力强度参数 热载荷 |
RESEARCHES ON THERMAL STRESSES AT THE INTERFACE EDGE OF A QFP WELDED JOINT |
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| Xuecheng Ping Mengcheng Chen Shaojun Ying.RESEARCHES ON THERMAL STRESSES AT THE INTERFACE EDGE OF A QFP WELDED JOINT[J].Acta Mechnica Solida Sinica,2011(Z1). |
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| Authors: | Xuecheng Ping Mengcheng Chen Shaojun Ying |
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| Institution: | Xuecheng Ping Mengcheng Chen Shaojun Ying(School of Mechatronics Engineering,East China Jiaotong University,Nanchang,330013) |
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| Abstract: | Due to the mismatches of thermomechanical properties among the pin,PCB and solder of a QFP welded joint,singular thermal stresses,which are an inducement of interfacial delamination,will occur at the interface edges of these materials.In order to evaluate the local mechanical behavior of the QFP welded joint,in the paper,singular thermal stresses as well as the corresponding generalized stress intensity factors(GSIFs) at the interface edge of an arbitrary bi-material wedge is determined numerically based on... |
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| Keywords: | PCB interface edge SIF thermal loading |
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