Thermal and mechanical characterizations of asubstrate-free focal plane array |
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Authors: | Cheng Teng Zhang Qing-Chuan Chen Da-Peng Shi Hai-Tao Gao Jie Qian Jian and Wu Xiao-Ping |
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Institution: | CAS Key Laboratory of Mechanical Behavior and Design of Materials, University of Science and Technology of China, Hefei 230027, China; Institute of Microelectronics, Chinese Academy of Science, Beijing 100029, China |
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Abstract: | We propose a substrate-free focal plane array (FPA) in
this paper. The solid substrate is completely removed, and the
microcantilevers extend from a supporting frame. Using finite
element analysis, the thermal and mechanical characterizations
of the substrate-free FPA are presented. Because of the large
decrease in thermal conductance, the supporting frame is temperature
dependent, which brings out a unique feature: the lower the thermal
conductance of the supporting frame is, the higher the energy
conversion efficiency in the substrate-free FPA will be. The results
from the finite element analyses are consistent with our
measurements: two types of substrate-free FPAs with pixel sizes
of 200$\times $200 and 60$\times $60~$\mu $m$^{2}$ are implemented
in the proposed infrared detector. The noise equivalent temperature
difference ({NETD}) values are experimentally measured to be 520 and
300~mK respectively. Further refinements are considered in various
aspects, and the substrate-free FPA with a pixel size of 30$\times
$30~$\mu $m$^{2}$ has a potential of achieving an {NETD} value of
10~mK. |
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Keywords: | focal plane array infrared detectors substrate-free uncooled |
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