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Hybrid integration for silicon photonics applications
Authors:L Grenouillet  T Dupont  P Philippe  J Harduin  N Olivier  D Bordel  E Augendre  K Gilbert  P Grosse  A Chelnokov  J M Fedeli
Institution:1. CEA, LETI, Minatec Campus, 17 rue des Martyrs, 38054, Grenoble Cedex 9, France
Abstract:In this paper we show how III-V semiconductors can benefit from advanced silicon fabrication processes and comply with their environment in particular to achieve electrically pumped III-V on silicon lasers for both intra-chip and off-chip applications.
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