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Experimental Investigation of Vapor Chamber Module Applied to High-Power Light-Emitting Diodes
Authors:H-S Huang  Y-C Chiang  C-K Huang  S-L Chen
Institution:1. Department of Mechanical Engineering , National Taiwan University , Taipei, Taiwan;2. Department of Mechanical Engineering , Chinese Culture University , Taipei, Taiwan;3. Department of Bio-Industrial Mechatronics Engineering , National Taiwan University , Taipei, Taiwan
Abstract:This article experimentally investigates the thermal performance of the vapor chamber module applied to the high-power light-emitting diodes in natural convection. The flat-plate-type vapor chamber and the lamp-type vapor chamber are provided to solve the heat dissipation problem of the high-power light-emitting diodes. The results show that the spreading resistance and the corresponding temperature difference of the flat-plate-type vapor chamber at 30 W are lower than those of the copper plate by 34% and 4°C, respectively, and are lower than those of the aluminum plate by 56% and 6°C, respectively. Compared with the copper and aluminum plates, the lamp-type vapor chamber at 15 W is reduced about 8% and 12% for the total thermal resistance, respectively. In addition, it is also about 3°C and 5°C lower for the central wall temperature of the lighting side, respectively. This study provides a new thermal management method to solve the heat dissipation of the high-power light-emitting diodes. Furthermore, the vapor chamber can effectively lower the spreading resistance and diminish the hotspot effect.
Keywords:natural convection  flat-plate-type vapor chamber  lamp-type vapor chamber  spreading resistance
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