Tensile, creep, and ABI tests on sn5%sb solder for mechanical property evaluation |
| |
Authors: | K Linga Murty Fahmy M Haggag Rao K Mahidhara |
| |
Institution: | (1) North Carolina State University, 27695-7909 Raleigh, NC;(2) Advanced Technology Corporation, 661 Emory Valley Road, Suite A, 37830 Oak Ridge, TN;(3) Tessera Inc., 3099 Orchard Dr., 95134 San Jose, CA |
| |
Abstract: | Sn5%Sb is one of the materials considered for replacing lead containing alloys for soldering in electronic packaging. We evaluated
the tensile properties of the bulk material at varied strain-rates and temperatures (to 473K) to determine the underlying
deformation mechanisms. Stress exponents of about three and seven were observed at low and high stresses, respectively, and
very low activation energies for creep (about 16.7 and 37.7 kJ/mole) were noted. A maximum ductility of about 350% was noted
at ambient temperature. Creep tests performed in the same temperature regime also showed two distinct regions, albeit with
slightly different exponents (three and five) and activation energy (about 54.4 kJ/mole). Ball indentation tests were performed
on the shoulder portions of the creep samples (prior to creep tests) using a Stress-Strain Microprobe@ (Advanced Technology Corporation) at varied indentation rates (strain-rates). The automated ball indentation (ABI) data were
at relatively high strain-rates; however, they were in excellent agreement with creep data, while both these results deviated
from the tensile test data. Work is planned to perform creep at high stresses at ambient and extend ABI tests to elevated
temperatures. |
| |
Keywords: | Chemical diffusion Creep Deformation mechanisms Dislocation glide Dislocation pipe diffusion Grain-boundary diffusion Lead-free Self-diffusion Solder Tensile properties |
本文献已被 SpringerLink 等数据库收录! |
|