延伸波长InGaAs探测器封装用二级热电制冷器性能研究

真空封装技术是延伸波长InGaAs探测器的主要封装方法之一,热电制冷器可为延伸波长InGaAs探测器焦平面提供低温环境。测试了基于真空封装技术无热负载条件下二级热电制冷器的性能,研究了二级热电制冷器在不同输入电流(功率)时冷、热端温差与热负载的关系,测试了二级热电制冷器在低温工况下的制冷性能以及二级热电制冷器处于不工作状态时的表观热导率。结果表明,热沉温度为274 K时,冷端可以达到221.4 K并实现77.5 K的冷、热端温差；当输入电流一定时,随着热负载的增加,冷、热端温差呈线性趋势减小,且斜率随着输入电流增大而增大；二级热电制冷器冷、热端温差在较高温度时更大,即制冷性能更好；当温度分别为233.1 K 和249.8 K时,表观热导率分别为11.30 W/(m·K)和8.29 W/(m·K)。

Performance study of two stage thermoelectric refrigerator for extended wavelength InGaAs detectors

Vacuum packaging technology is one of the main packaging methods for extended wavelength InGaAs detectors,thermoelectric coolers used to provide a low temperature environment for the focal plane of extended wavelength InGaAs detectors.The performance of the two stage thermoelectric cooler under the condition of vacuum packaging technology without thermal load was tested.The relationship between the cold and hot end temperature difference and the thermal load of the two stage thermoelectric cooler at different input currents (power) was studied.The refrigeration performance of the two stage thermoelectric cooler under low temperature conditions and the apparent thermal conductivity of the two stage thermoelectric cooler when it is not working were tested.The results show that when the heat sink temperature is 274 K,the cold end can reach 221.4 K and the cold and hot end temperature difference is about 77.5 K.When the input current is constant,as the thermal load increases,the temperature difference between the cold and hot end decreases linearly,and the slope increases with the increase of the input current.The temperature difference between the cold and hot end of the two stage thermoelectric cooler is larger at higher temperatures,that is,the refrigeration performance is better;when the temperature is 233.1 K and 249.8 K,the apparent thermal conductivity is 11.30 W/(m·K) and 8.29 W/(m·K)respectively.