Electrical and microscopic characterization of ZnO films on p-SiC substrates

ZnO/p- SiC heterojunctions were fabricated by thermal evaporation from ZnO high quality powder (99.99%) onto 4H and 6H p-SiC polytypes. We find that, despite the low cost technique employed for the deposition of the ZnO film, the devices exhibited breakdown voltages in excess of 100 V, high rectification ratio (forward to reverse current ratio, I_F/I_R) and low leakage current, respectively, 2×10⁵ and 4.5×10⁻⁷ A/cm² (for the 4H p-SiC based device) and 5×10⁴ and 5×10⁻⁷ A/cm² (for the 6H p-SiC based device). The current-voltage (I×V) characteristics were also measured at the nanometer scale by means of conductive atomic force microscopy. A simple Schottky diode model and conductance divided by current versus conductance plots (G/I×G plots) was used to analyze device characteristics. This analysis shows that, when probing at the nanometric scale, fluctuations of the effective barrier height and/or surface states across individual grains or grain boundaries cause deviations from linear G/I×G plots. These fluctuations are smeared out when probing at the macroscale and thus it becomes possible to obtain linear plots and extract diode parameters.