| HDI印制板制作中涨缩控制及爆板问题的研究 |
| |
| 引用本文： | 黄志远,陈亨,操孝明,金轶,朱萌,刘学慧,何为. HDI印制板制作中涨缩控制及爆板问题的研究[J]. 印制电路信息, 2012, 0(5): 50-53 |
| |
| 作者姓名： | 黄志远 陈亨 操孝明 金轶 朱萌 刘学慧 何为 |
| |
| 作者单位： | 1. 铜陵超远精密电子科技有限公司,安徽铜陵,244000
2. 电子科技大学微电子与固体电子学院,四川成都,610054 |
| |
| 摘 要： | HDI印制板制作中存在很多任务艺难题,重点研究了HDI板层压过程的涨缩控制及埋孔密集区域的爆板问题,并针对爆板问题提出相应的改善方法。
|
| 关 键 词： | HDI 涨缩 爆板 |
Study on the expansion and contraction control and delamination problem of HDI printed circuit board |
| |
| HUANG Zhi-yuan,CHEN Heng,CAO Xiao-ming,JIN Yi,ZHU Meng,LIU Xue-hui,HE Wei. Study on the expansion and contraction control and delamination problem of HDI printed circuit board[J]. Printed Circuit Information, 2012, 0(5): 50-53 |
| |
| Authors: | HUANG Zhi-yuan CHEN Heng CAO Xiao-ming JIN Yi ZHU Meng LIU Xue-hui HE Wei |
| |
| Affiliation: | HUANG Zhi-yuan CHEN Heng CAO Xiao-ming JIN Yi ZHU Meng LIU Xue-hui HE Wei |
| |
| Abstract: | There are lots of problems in the production process of HDI PCB.In this article,the expansion and contraction control of PCB material in lamination process was studied.The reason of delamination in the area of densely buried via was found and the corresponding improvement was proposed. |
| |
| Keywords: | HDI expansion and contraction delamination |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
