| GaAs单片电路封装 |
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| 引用本文： | 付花亮. GaAs单片电路封装[J]. 微电子学, 1996, 26(1): 52-57 |
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| 作者姓名： | 付花亮 |
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| 作者单位： | 电子工业部第１３研究所 |
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| 摘 要： | 简述了微波在封装中的传输特性，以及不同封装型式和材料的ＧａＡｓＭＭＩＣ封装，介绍了多层共烧陶瓷在ＭＭＩＣ封装中的应用。最后，综述了国外ＧａＡｓＭＭＩＣ的最新封装与互连技术。
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| 关 键 词： | 封装 砷化镓 单片集成电路 |
Packaging of GaAs Monolithic Integrated Circuits |
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| FU Hualiang. Packaging of GaAs Monolithic Integrated Circuits[J]. Microelectronics, 1996, 26(1): 52-57 |
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| Authors: | FU Hualiang |
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| Abstract: | Transfer characteristics of microwave in packages is investigated. different type of packages and packaging materials for the GaAs MMIC's are described. The application of multilayer co-fired ceramics to MMIC packaging is introduced. Finally,novel techniques for packaging and interconnecting of GaAs MMIC's abroad are reviewed. |
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| Keywords: | IC Package GaAs IC MMIC |
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