| 水浴条件下YAG倍频激光切割Si片的实验研究 |
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| 引用本文： | 凌磊,楼祺洪,李抒智,叶震寰,董景星,魏运荣.水浴条件下YAG倍频激光切割Si片的实验研究[J].激光技术,2004,28(2):131-132,143. |
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| 作者姓名： | 凌磊 楼祺洪 李抒智 叶震寰 董景星 魏运荣 |
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| 作者单位： | 1.中国科学院, 上海光学精密机械研究所, 上海, 201800 |
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| 摘 要： | 用Nd:YAG固体倍频激光器在水中对Si片进行微刻蚀比在空气中产生的飞溅物少。对两种条件下的刻蚀速率、刻槽表面形貌进行了比较。实验结果得到最窄的刻缝宽度小于50μm,表面不平整度小于5μm,为工业用激光切割Si片提供了更好的工艺。
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| 关 键 词： | YAG固体倍频激光 切割 Si片 水浴 |
| 文章编号： | 1001-3806(2004)02-0131-02 |
| 收稿时间： | 2003/6/18 |
| 修稿时间： | 2003-07-22 |
Microcutting Si wafer in water bath by second harmonic output of YAG laser |
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| LING Lei,LOU Qi-hong,LI Shu-zhi,YE Zheng-huan,DONG Jing-xing,WEI Yun-rong.Microcutting Si wafer in water bath by second harmonic output of YAG laser[J].Laser Technology,2004,28(2):131-132,143. |
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| Authors: | LING Lei LOU Qi-hong LI Shu-zhi YE Zheng-huan DONG Jing-xing WEI Yun-rong |
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| Abstract: | The results are reported that the splashes of microcutting Si wafer by second harmonic output of YAG laser in water bath may be fewer than in air environment.The surface morphology and etching rate for water bath and air environment are compared in detail.The cutting gap as small as 50μm with edge fluctuation less than 5μm is obtained in water bath.This technology may be helpful for industrial applications. |
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| Keywords: | second harmonic output of YAG laser cutting Si wafer water bath |
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