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Characterization of electronic materials and devices by scanning near-field microscopy
Authors:LJ Balk  R Heiderhoff  JCH Phang  Ch Thomas
Institution:1.Fachbereich Elektrotechnik, Informationstechnik, Medientechnik, Lehrstuhl für Elektronik,Bergische Universit?t Wuppertal,Wuppertal,Germany;2.Department of Electrical and Computer Engineering, Centre for Integrated Circuit Failure Analysis and Reliability (CICFAR),National University of Singapore,Singapore,Singapore
Abstract:
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