| 无铅回流焊焊点形成过程的实时监测与分析 |
| |
| 引用本文： | 连钠,张冬月,徐广臣,郝虎,郭福.无铅回流焊焊点形成过程的实时监测与分析[J].电子元件与材料,2012,31(5):60-62,70. |
| |
| 作者姓名： | 连钠 张冬月 徐广臣 郝虎 郭福 |
| |
| 作者单位： | 北京工业大学材料科学与工程学院,北京,100124 |
| |
| 基金项目： | 国家自然科学基金资助项目（No. 51071006）；北京市自然科学基金（B类）教育博士点基金资助项目（No. 20101103110000） |
| |
| 摘 要： | 利用实时摄像、图像采集、转录装置等对电容、电阻、塑封有引线芯片载体(PLCC)、二极管等元器件的无铅回流焊过程进行了实时监测和同步拍摄,实时记录了回流焊过程中焊点形成的全过程。特别地,分析了回流焊过程中焊膏对元件所表现出的极强的自对中能力及一些焊接缺陷(如立碑现象)的形成过程。
|
| 关 键 词： | 无铅回流焊 实时监测 自对中能力 立碑 |
Real-time monitoring and analysis of solder joint formation in the lead-free reflow process |
| |
| LIAN Na
,
ZHANG Dongyue
,
XU Guangchen
,
HAO Hu
,
GUO Fu.Real-time monitoring and analysis of solder joint formation in the lead-free reflow process[J].Electronic Components & Materials,2012,31(5):60-62,70. |
| |
| Authors: | LIAN Na ZHANG Dongyue XU Guangchen HAO Hu GUO Fu |
| |
| Abstract: | The lead-free reflow soldering processes of several components such as capacitor, resistor, PLCC and diodes, etc., were monitored and photoed in real-time by using real-time videotaping, image collecting, and video converting equipments. The all form process of the solder joints in the reflow was recorded. Specially, the self-aligning ability of the solder paste to components and the formation processes of soldering defects, such as tomb stoning, were studied. |
| |
| Keywords: | lead-free reflow soldering monitored in real-time self-aligning ability tomb stoning |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
