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| 无铅BGA枕头缺陷的研究 | |
| 引用本文： | 侯昌锦,王会芬,吴金昌,张亚非.无铅BGA枕头缺陷的研究[J].电子工艺技术,2012,33(2):63-66,126. |
| 作者姓名： | 侯昌锦 王会芬 吴金昌 张亚非 |
| 作者单位： | 1. 上海交通大学微纳科学技术研究院,上海200240／广达上海制造城表面贴装技术实验室,上海201613 2. 广达上海制造城表面贴装技术实验室,上海,201613 3. 上海交通大学微纳科学技术研究院,上海,200240 |
| 基金项目： | 国家自然科学基金项目，上海市科技项目 |
| 摘 要： | BGA枕头焊点的锡膏和锡球完全没有融合成为一体,倒过来看就像头压在枕头上面。介绍了四种有效的检测方法。从设计、材料和工艺三方面分析了枕头缺陷的潜在影响因素。选取PCB玻璃态转化温度、钢网厚度、BGA贴装偏移量和回流焊炉链条速度四个因素进行两水平全因子实验设计,在成功复制枕头缺陷的基础上,分析了各因素的影响作用,得出了链条速度是最显著的影响因素。 |
| 关 键 词： | BGA焊点 枕头缺陷 DOE实验设计 |
Study on Head.in.Pillow Defect for Lead Free BGA |
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| HOU Chang-jin,WANG Hui-fen,WU Jin-chang,ZHANG Ya-fei.Study on Head.in.Pillow Defect for Lead Free BGA[J].Electronics Process Technology,2012,33(2):63-66,126. | |
| Authors: | HOU Chang-jin WANG Hui-fen WU Jin-chang ZHANG Ya-fei |
| Institution: | 1 (1.Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University,shanghai 200240,China; 2.SMT Lab of Quanta Shanghai Manufacture City,Shanghai 201613,China) |
| Abstract: | Solder paste and solder ball are not completely fused into one BGA head-in-pillow,Upside down as head on a pillow.Four effective methods for observing are introduced.And analyze the potential factors of this defect from design, materials and process.Then select PCBθg point,stencil thickness,BGA mounting deviant and reflow chain speed as four factors to DOE.After successfully copy the head-in-pillow defect,discuss the effect of all factors.Finally find that the chain speed is the most significant one. |
| Keywords: | Lead free BGA solder joint Head-in-Pillow defect DOE |
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