PCB酸性蚀刻液中缓蚀剂对厚铜线路制作的影响

以2-巯基苯并噻唑(2-MBT)、 苯并三氮唑(BTA)和苯氧基乙醇(MSDS)作为缓蚀剂, 研究了其加入在酸性蚀刻液后对PCB厚铜线路的缓蚀效果。通过接触角测试、电化学测试和蚀刻因子得出缓蚀状态,并结合扫描电子显微镜观察铜表面形貌。通过分子动力学计算和量子化学模拟分析缓蚀剂在铜表面的吸附机理。结果表明,2-MBT + MSDS与BTA + MSDS的分子结构可有效地平行吸附在铜表面,且吸附能高于单一缓蚀剂。加入了2-MBT + MSDS的蚀刻液,对厚度约为33 μm铜线路进行刻蚀,铜线路的蚀刻因子提高到6.59,可有效应用于PCB厚铜线路制作。

Effect of Corrosion Inhibitors on Copper Etching to Form Thick Copper Line of PCB in Acidic Etching Solution

The chemical compounds of 2-mercaptobenzothiazole (2-MBT), benzotriazole (BTA) and phenoxyethanol (MSDS) as corrosion inhibitors were used to inhibit the copper etching to form the thick copper line of PCB in the acidic etching solution. The inhibition status was characterized with contact angle measurement, electrochemical test and etch factor calculation, while the corrosion morphology of copper surface was studied by scanning electron microscope. The adsorption mechanism of corrosion inhibitors on copper surface is analyzed by molecular dynamics and quantum chemistry calculations. The results indicated that the synergistic function of the two inhibitors could effectively promote their adsorption on the copper surface in parallel, while their adsorption energy could be higher than that of the single inhibitor. The etch factor of the thick copper line with about 33 μm in thickness increased to 6.59 from the etching solution with 2-MBT and MSDS for good agreement of PCB manufacture.