特殊整平剂甲基橙在通孔电镀铜的应用

甲基橙具有两种基团,可以同时起到加速和抑制作用,可作为特殊的整平剂应用与通孔电镀铜实验中。通过分子动力学模拟和量子化学计算来表征甲基橙在通孔电镀铜中的作用,结果表明甲基橙可以很好地吸附在阴极表面并抑制铜的电沉积。 通过恒电流测试和循环伏安测试结果显示, 甲基橙由于同时具有磺酸基的去极化和其分子结构部分的极化作用, 形成协同分子内对铜加速还原和阻碍传质的竞争效应, 所以几乎不影响电位。在板厚孔径为10:1的通孔电镀铜实验中, 仅以甲基橙和环氧乙烷和环氧丙烷嵌段共聚物作为添加剂, TP值可达到92.34%。

Investigation of Through-Hole Copper Electroplating with Methyl Orange as A Special Leveler

Methyl Orange (MO) with two kinds of functional groups can act as both an accelerator and an inhibitor, which has been used as a special leveler to simplify the electroplating additive system in the through-hole (TH) copper electroplating experiments. In this work, the role of MO in TH electroplating is characterized by molecular dynamics simulations and quantum chemical calculations. It is suggested that MO can spontaneously flatten the copper surface and be well adsorbed on the cathode surface, which inhibit the copper electrodeposition on the cathode. Electrochemical behavior of MO was evaluated by galvanostatic measurements (GM) and cyclic voltammetry (CV) to confirm that MO hardly affects the potential due to its duel functions of depolarizing and polarizing effects from the molecular structure of sulfonic acid group and other groups to achieve the internal Cu²⁺ reduction acceleration and mass transfer inhibition. Throw power value of TH with the aspect ratio of 10:1 could reach 92.34% from the base plating solution bath with the additions of only EO/PO and MO. The study of MO could provide new ideas for the development of electroplating additive system.