A study on electroplating of zinc nickel alloy with HEDP plating bath |
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| Authors: | Z -L Wang Y -X Yang J -B Zhang H Zhu Y -R Chen |
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| Institution: | (1) College of Applied Technology, Wenzhou University, 325035, P.R. China;(2) School of Chemistry and Pharmaceutics, East China University of Science and Technology, 200237, P.R. China;(3) College of Environmental Sciences, Peking University, Beijing, 100871, P.R. China;(4) Coordination Chemistry Institute, Nanjing University, Nanjing, 210093, P.R. China |
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| Abstract: | The electroplating of bright Zn-Ni alloy process using HEDP as coordinating agent, ZNP as additive agent is studied. The effect
of coordinating agent, chloride content, Zn2+]/Ni2+], cathode current density, temperature, and supplementary coordinating agent on Ni content is investigated; composition and
physical phase of alloy plating layer, brightness of plating layer, and stability of plating solution are comprehensive considered;
and also, the optimum composition of plating solution for bright Zn-Ni alloy electroplating and technological condition is
determined; finally, deposition mechanism is discussed.
Published in Russian in Elektrokhimiya, 2006, Vol. 42, No. 1, pp. 25–30.
The text was submitted by the authors in English. |
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| Keywords: | electroplating zinc nickel alloy physical phase HEDP |
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