| 谈电子产品中铝制件预处理工艺配方 |
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| 引用本文： | 王爱荣,魏建中. 谈电子产品中铝制件预处理工艺配方[J]. 电子工艺技术, 2001, 22(2): 84-85 |
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| 作者姓名： | 王爱荣 魏建中 |
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| 作者单位： | 国营第七六零厂, |
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| 摘 要： | 随着电子技术的发展，电子产品中铝制件电镀愈来愈多。铝制件电镀质量的好坏，预处理是关键。就浸锌酸盐和浸锌镍合金两种预处理工艺配方在本厂生产中的实际应用情况作以比较。
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| 关 键 词： | 镀前预处理艺术 铝制件 电子产品 |
| 文章编号： | 1001-3474(2001)02-0084-02 |
| 修稿时间： | 2000-11-16 |
Talk on Pre-treatment Technological Formula of Aluminium-parts in Electronic Production |
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| WANG Ai-rong,WEI Jian-zhong. Talk on Pre-treatment Technological Formula of Aluminium-parts in Electronic Production[J]. Electronics Process Technology, 2001, 22(2): 84-85 |
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| Authors: | WANG Ai-rong WEI Jian-zhong |
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| Abstract: | With the development of electronic technology,electroplating of aluminium-parts in electronic production becomes more and more.Whether electroplating quality is good or bad depends on pre-treatment.Two pre-treatment technological formula on dipped zincate salt and dipped Zinc-nickel alloy which were practiced in our factory are compared. |
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| Keywords: | Pre-treatment before plating Dipped Zinc-nickel alloy Complicated parts Parts with blind holes |
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