Moiré interferometry for deformation measurement |
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Authors: | A Asundi |
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Institution: | Department of Mechanical Engineering, University of Hong Kong, Hong Kong |
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Abstract: | Moiré interferometry utilizes high frequency gratings to contour displacement components with a sensitivity of the order of 0·5 μ. This paper briefly reviews the technique for in-plane deformation measurement and its current applications to analyze adhesive bonded joints and composite deformation. The modified set-up for out-of-plane displacement measurement is described and used for fracture mechanics studies and vibration analysis. Finally, a set-up for simultaneous measurement of all three displacement components is described. |
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