首页 | 本学科首页   官方微博 | 高级检索  
     检索      


Moiré interferometry for deformation measurement
Authors:A Asundi
Institution:

Department of Mechanical Engineering, University of Hong Kong, Hong Kong

Abstract:Moiré interferometry utilizes high frequency gratings to contour displacement components with a sensitivity of the order of 0·5 μ. This paper briefly reviews the technique for in-plane deformation measurement and its current applications to analyze adhesive bonded joints and composite deformation. The modified set-up for out-of-plane displacement measurement is described and used for fracture mechanics studies and vibration analysis. Finally, a set-up for simultaneous measurement of all three displacement components is described.
Keywords:
本文献已被 ScienceDirect 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号