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Effects of stress conditions on the generation of negative bias temperature instability-associated interface traps
Institution:a School of Microelectronics, Xidian University, Xi’an 710071, China;b State Key Discipline Laboratory of Wide Bandgap Semiconductor Technologies, Key Laboratory of WideBandgap Semiconductor Materials and Devices of Ministry of Education, Xi’an 710071, China;c School of Technical Physics, Xidian University, Xi’an 710071, China
Abstract:The exponent n of the generation of an interface trap (Nit), which contributes to the power-law negative bias temperature instability (NBTI) degradation, and the exponent’s time evolution are investigated by simulations with varying the stress voltage Vg and temperature T. It is found that the exponent n in the diffusion-limited phase of the degradation process is irrelevant to both Vg and T. The time evolution of the exponent n is affected by the stress conditions, which is reflected in the shift of the onset of the diffusion-limited phase. According to the diffusion profiles, the generation of the atomic hydrogen species, which is equal to the buildup of Nit, is strongly correlated with the stress conditions, whereas the diffusion of the hydrogen species shows Vg-unaffected but T-affected relations through the normalized results.
Keywords:negative bias temperature instability  reaction–diffusion model  interface trap  
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