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The effect of hydrogen as an additive in reactive ion etching of GaAs for obtaining polished surface
Authors:FN Dultsev  LA Nenasheva
Institution:Russian Academy of Sciences, Institute of Semiconductor Physics SB RAS, Lavrentyev av., 13, 630090 Novosibirsk, Russia
Abstract:The effect of hydrogen on the reactive ion etching (RIE) of GaAs in the CF2Cl2 plasma is discussed. The addition of hydrogen into the reaction mixture improves the sharpness of etch borders; the etched surface is smooth for etching depth > 1 μm, etching rate is time-constant.
Keywords:Reactive ion etching  Gallium arsenide  Hydrogen  Surface roughness
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