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Inhibition of copper corrosion by self-assembled films of new Schiff bases and their modification with alkanethiols in aqueous medium
Authors:M. Ehteshamzade  M.G. Hosseini
Affiliation:a Department of Materials Engineering, Tarbiat Modarres University, Tehran, Iran
b Electrochemistry Research Laboratory, Department of Physical Chemistry, Chemistry Faculty, Tabriz University, Iran
Abstract:The inhibitive action of self-assembled films derived from two ligands Schiff bases, including N,N′-ethylen-bis (salicylidenimine) and N,N′-ortho-phenylen-bis (salicylidenimine) on copper surface has been studied by electrochemical techniques in chloride and acidic solutions. It was found that when the concentration of the inhibitors was increased the inhibition efficiency was increased, too. The results of the electrochemical studies have illustrated that the inhibition efficiency of S-o-ph-S is higher than S-E-S. Both the Schiff bases obeyed the Langmuir isotherm and thermodynamics calculations revealed that S-o-ph-S had larger adsorption constant and more negative free energy of adsorption with respect to S-E-S. When the films were modified by propanethiol and 1-dodecanethiol, the corrosion resistance of mixed films was significantly increased.
Keywords:Schiff bases   Corrosion inhibitors   Acidic medium   Chloride medium   Self-assembled films   Copper
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