| Affiliation: | 1. Department of Physics, The Chinese University of Hong Kong, Shatin, New Territories, Hong Kong, China;2. Department of Physics, The Ohio State University, Columbus, OH 43210, USA;1. School of Materials Science and Engineering, Qiqihar University, Qiqihar 161006, China;2. Center of Super-Diamond and Advanced Films (COSDAF), Department of Physics and Materials Science, City University of Hong Kong, Hong Kong SAR, China;3. School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China;4. Department of Mechanical Engineering, Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong 999077, China;5. Institute of Nanosurface Science and Engineering, Guangdong Provincial Key Laboratory of Micro/Nano Optomechatronics Engineering, Shenzhen University, Shenzhen 518060, China;1. Department of Aerospace Engineering, University of Michigan, Ann Arbor, USA;2. Department of Mechanical Engineering, University of South Carolina, Columbia, USA;1. Department of Physics and Astronomy, University of Delaware, Newark, Delaware 19716, USA;2. State Key Laboratory of Surface Physics and Department of Physics, Fudan University, Shanghai 200433, PR China;3. Center for Integrated Spintronic Devices, Hangzhou Dianzi University, Hangzhou, Zhejiang 310018, PR China;1. Laboratoire Matière et Systèmes Complexes, UMR 7057 CNRS, Université Denis Diderot-Paris 7, 10 rue A. Domon et L. Duquet, 75013 Paris Cedex, France;2. Université d’Evry-Val d’Essonne, France;1. LFIN, Louvain Finance, Université catholique de Louvain, Place des Doyens, 1, 1348 Louvain-la-Neuve, Belgium;2. CeReFiM, DeFiPP, Department of Business Administration, University of Namur, Rempart de la Vierge 8, 5000 Namur, Belgium;3. NaXys, Department of Mathematics, University of Namur, Rempart de la Vierge 8, 5000 Namur, Belgium |
