| 微电子封装实验技术的回顾及发展现状 |
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| 引用本文： | 史训清,谢惠民,戴福隆.微电子封装实验技术的回顾及发展现状[J].实验力学,2002,17(Z1):223-244. |
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| 作者姓名： | 史训清 谢惠民 戴福隆 |
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| 作者单位： | 1. 新加坡Gintic制造工程研究所;北京航空航天大学,北京,100083
2. 清华大学,工程力学系,北京,100084 |
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| 基金项目： | 国家自然科学基金，国家自然科学基金 |
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| 摘 要： | 微电子封装,包括微电力系统及光电子封装,为实验力学开辟了新的研究应用领域,也对传统实验测试方法和测量技术提出挑战.本文讨论了微电子封装的发展趋势、微电子封装可靠性及相关力学问题.随后回顾了微观实验技术在微电子封装领域的发展,最后作者着重提出了一些提高微电子封装组件的可靠性的研究方法及思路.
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| 关 键 词： | 微电子封装 可靠性 云纹干涉 |
An Overview of Current Research Status of Micro-Experimental Mechanics Methodology in Microelectronics Packaging |
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| SHI Xun-qing,XIE Hui-min,DAI Fu-long.An Overview of Current Research Status of Micro-Experimental Mechanics Methodology in Microelectronics Packaging[J].Journal of Experimental Mechanics,2002,17(Z1):223-244. |
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| Authors: | SHI Xun-qing XIE Hui-min DAI Fu-long |
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| Abstract: | The development of microelectronics packages, including microelectromechanical system (MEMS) and optoelectronics packages, starts a new research and application area of experimental mechanics. It also challenges the traditional experimental mechanics testing approaches and measurement techniques. In this paper, the development trend of electronics packaging is briefed. The reliability issues in microelectronics packages and the corresponding mechanics problems are then addressed. Afterwards, the current research status of microexperimental methodology in microelectronics packaging will be reviewed. Finally, in authors'view, some important research activities, which can help the design of microelectronics packages with robust reliability, are proposed. |
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