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Spectromicroscopic study of plasma-treatment effect on InP-substrate-based silicon nitride and silicon oxide patterns
Authors:M.-K.?Lee,H.-J.?Shin  author-information"  >  author-information__contact u-icon-before"  >  mailto:shj@postech.ac.kr"   title="  shj@postech.ac.kr"   itemprop="  email"   data-track="  click"   data-track-action="  Email author"   data-track-label="  "  >Email author,J.-H.?Choi,D.-S.?Bang
Affiliation:(1) New Materials Evaluation Center, Korea Research Institute of Standards and Science, Taeduk Science Town, 305-600 Taejon, Korea;(2) Physics Department, POSTECH, 790-784 Pohang, Korea;(3) AE Center, Samsung Advanced Institute of Technology, Suwon, Korea;(4) Photonics Division, Samsung Electronics, Suwon, Korea
Abstract:Oxygen-plasma treatment was applied to silicon nitride and silicon oxide patterns on an InP substrate, and the effect was investigated by using scanning photoelectron microscopy. After the plasma treatment, the relative intensity of the carbon content was noticeably reduced on the surfaces of the patterns and the substrate, which indicates that the plasma treatment effectively removed the remaining carbon and made the patterns more resistant to carbon contamination. The oxygen-plasma treatment formed a thick oxidized surface on the InP substrate, which results in less occurrence of carbon contamination . PACS 68.37.Xy; 52.77.Bn; 85.40.-e
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