Rapid Ag/Sn/Ag transient liquid phase bonding for high-temperature power devices packaging by the assistance of ultrasound |
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| Institution: | 1. Department of Physics and Nanotechnology, Aalborg University, Skjernvej 4A, 9220 Aalborg, Denmark;2. Department of Mechatronics, University of Applied Sciences Kiel, Grenzstraße 5, 24149 Kiel, Germany;1. College of Materials Science and Engineering, Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan University of Technology, Taiyuan, Shanxi 030024, PR China;2. Department of Mechanical Engineering, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Tsinghua University, Beijing 100084, PR China;3. School of Materials Science and Engineering, Tsinghua University, Beijing 100084, PR China;4. R&D Department, Yongtai Electric (Dong Guan) Co., Ltd, Dongguan, Guangdong 523000, PR China;5. State Key Laboratory of Advanced Welding & Joining, School of Materials Science and Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, PR China |
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| Abstract: | Rapid transient liquid phase (TLP) bonding process on Ag/Sn/Ag system is achieved in air by the assistance of ultrasonic, which has great potential to be applied to high-temperature power devices packaging. In this study, the influence of ultrasonic effect on the morphology and growth kinetics of Ag3Sn grains, and the joint microstructure, mechanical property and thermal reliability were systematically investigated. Experimental results indicated that the rapid consumption of the “dynamic” transient liquid phase was attributed to the accelerated dissolution of Ag substrate and the extrusion of liquid Sn, which were entirely induced by the complex sonochemical effects on the liquid/solid intermetallic compounds (IMCs) interface. An elongated scallop-like morphology of Ag3Sn grains was developed during Ag/Sn interfacial reaction with ultrasonic, accompanied by widening of grooves between neighbored grains. This phenomenon is called as a strengthening thermal grooving, in which the grooves at grain boundaries provide stable molten channels for Ag atoms diffusion from the substrate. Consequently, the improved elemental diffusion was evaluated through the growth kinetics of Ag3Sn IMCs, with conservative estimation of 6–16.5 times faster than the traditional TLP process. In addition, both excellent mechanical property and thermal reliability of the Ag-Sn intermetallic joint were experimentally verified by shear test and high-temperature storage test, respectively. |
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| Keywords: | TLP bonding Ultrasonic Intermetallic compounds Growth kinetics Thermal grooving Reliability |
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