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A Noninvasive, on Wafer Method to Determine the Intrinsic Stress of a Polymer Layer |
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| Authors: | J Conklin J Helffrich R Cohn K Walsh H Cox |
| Institution: | (1) University of Louisville, 518 Moser Rd, Louisville, KY 40223, USA;(2) Southwest Research Institute, P.O. Drawer, 28510 San Antonio, TX 78228-0510, USA;(3) University of Louisville, Lutz Hall, Room 442 Brook St. and Warnock Ave., Louisville, KY 40292, USA;(4) University of Louisville, Lutz Hall, Room 444 Brook St. and Warnock Ave., Louisville, KY 40292, USA;(5) University of Louisville, W.S. Speed, Room 213 Eastern Parkway, Louisville, KY 40292, USA |
| Abstract: | The method described in this paper allows an investigator to determine the intrinsic stress of a polymer layer in a way that does not result in damage to devices or test structures. The method requires that a small area of the polymer be released from the substrate to form a diaphragm. The diaphragm is stimulated with acoustic white noise and the diaphragm movement is monitored with a laser vibrometer. The first few resonance frequencies of the diaphragm are obtained using a laser vibrometer and then those frequencies are used to calculate the membrane intrinsic bi-axial tension. |
| Keywords: | Diaphragm Testing MEMS Fabrication |
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