| Preparation of Electrically Conductive Filler for Anisotropic Conductive Adhesive |
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| 作者姓名： | 华丽 安兵 吴懿平 吴丰顺 王佳 何敬强 |
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| 作者单位： | State Key Lab.of Material Processing and Die & Mould Technology Huazhong Univ.of Science & Technology，State Key Lab.of Material Processing and Die & Mould Technology，Huazhong Univ.of Science & Technology，State Key Lab.of Material Processing and Die & Mould Technology，Huazhong Univ.of Science & Technology，State Key Lab.of Material Processing and Die & Mould Technology，Huazhong Univ.of Science & Technology，State Key Lab.of Material Processing and Die & Mould Technology，Huazhong Univ.of Science & Technology，State Key Lab.of Material Processing and Die & Mould Technology，Huazhong Univ.of Science & Technology，Wuhan 430074，China Wuhan National Lab.for Optoelectronics，Wuhan 430074，China，Wuhan 430074，China Wuhan National Lab.for Optoelectronics，Wuhan 430074，China，Wuhan 430074，China Wuhan National Lab.for Optoelectronics，Wuhan 430074，China，Wuhan 430074，China Wuhan National Lab.for Optoelectronics，Wuhan 430074，China，Wuhan 430074，Wuhan 430074 |
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| 基金项目： | The National Natural Science Foundation of China(No.10474024)，NSFC-RGC Joint Research Scheme(No.60318002)，Youth Chenguang Project of Science and Technology of Wuhan City of China(No.20065004116-10)，StateKey Lab.of Advanced Technology for Materials Synthesis and Processing(Wuhan University of Technology,No.WUT2004 M08) |
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| 摘 要： | Introduction As a competitive substitute of lead-containedsolder,ACAs appear a promising future due totheir numerous advantages,such as low-tempera-ture compatible assembly,higher packaging densi-ty,environmental friendliness,low-stress on thesubstrates.T…
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Preparation of Electrically Conductive Filler for Anisotropic Conductive Adhesive |
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| HUA Li,AN Bing,WU Yi-ping,WU Feng-shun,WANG Jia,HE Jing-qiang.Preparation of Electrically Conductive Filler for Anisotropic Conductive Adhesive[J].Journal of Shanghai Jiaotong University,2007(Z2). |
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| Authors: | HUA Li AN Bing WU Yi-ping WU Feng-shun WANG Jia HE Jing-qiang |
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| Institution: | HUA Li~1,2,AN Bing~1,2,WU Yi-ping~1,2WU Feng-shun~1,2,WANG Jia~1,HE Jing-qiang~1 |
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| Abstract: | |
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| Keywords: | anisotropic conductive adhesive(ACA) monodispersion polymerization microsphere electroless plating |
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