| 表面贴装技术 |
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| 引用本文： | 李佳,朱浩悦.表面贴装技术[J].国外电子元器件,2009,17(7):81-83. |
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| 作者姓名： | 李佳 朱浩悦 |
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| 作者单位： | 中国电子科技集团公司第二十研究所;西安文理学院计算机科学系; |
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| 摘 要： | 在介绍表面贴装技术（SMT）TL其流程的基础上，阐述焊接过程中回流焊炉的回流焊原理及回流焊温度曲线，并将实际生产中某印制电路板的实际回流焊温度曲线标准回流焊温度曲线与相对比，结果表明：只要满足实际回流焊温度区域在标准温度范围内，就能满足贴装元器件的性能指标。
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| 关 键 词： | 表面贴装技术(SMT) 印制电路板(PCB) 回流焊 温度曲线 |
Surface mount technology |
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| LI Jia,ZHU Hao-yue.Surface mount technology[J].International Electronic Elements,2009,17(7):81-83. |
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| Authors: | LI Jia ZHU Hao-yue |
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| Institution: | LI Jia1,ZHU Hao-yue2 |
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| Abstract: | On the basis of introducing of the surface mount technology and its fow,this paper expatiates the principle of solder-reflow and the temperature curve in the process of reflow soldering,and compares a kind of PCB＇s standard solderreflow temperature curve with the actual solder-reflow temperature curve of the actual production process, the result shows that as long as the actual solder-reflow temperature region is in the standard temperature range,it can meets the performance indicators of the surface mount element. |
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| Keywords: | surface mount technology(SMT) printed circuit board(PCB) reflow soldering temperature curve |
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