电子封装用SiC_p／Cu复合材料制备与性能

采用挤压铸造方法制备了体积分数为55％、不同颗粒粒径增强的电子封装用SiCp／Cu复合材料,并分析了颗粒尺寸和热处理状态对材料物理性能和力学性能的影响规律。显微组织观察表明SiC颗粒分布均匀,复合材料组织致密;随着SiC颗粒尺寸的减小,复合材料的平均线膨胀系数和热导率均降低;退火处理可以降低复合材料的热膨胀系数,同时提高材料的热导率。复合材料具有高的弯曲强度和弹性模量,退火处理后材料的弯曲强度降低,但弹性模量变化不大。

Fabrication and Properties of SiCp/Cu Composites for Electronic Packaging

The 55vo1.% SiCp/Cu composites with different particle sizes were fabricated by squeeze casting technology for electronic packaging applications also with the effect of particle size and annealing treatment on their thermo-physical and mechanical properties discussed. The microstructure observation showed the composites were dense and uniform as well as void free. The CTEs of SiCp/Cu composites decreased with the reducing of SiC particle sizes, and it could be further reduced by annealing treatment. As the particle size increased, the thermal conductivities of SiCp/Cu composites increased, which was similar to that after annealing. The SiCp/Cu composites exhibited high bending strength and elastic modulus at ambient temperature. After annealing, the bending strength of composites decreased slightly, and the elastic modulus kept unchanged.