高温还原氧化石墨烯膜及其导热性能

采用氧化还原法制备了结构致密且具有较高柔韧性的石墨烯薄膜,探究了薄膜经过较高退火温度还原后结构变化,并通过T型稳态法测量了其热导率,研究了还原温度对薄膜热导率和力学性能的影响。结果表明,高温还原有助于氧化石墨烯中含氧官能团的去除和sp2杂化碳晶格的恢复,并且温度越高还原效果越好。当还原温度高达2800℃时,在200~350 K温度范围内石墨烯膜的热导率在336.9~436 W·m^-1·K^-1之间,伴随着温度的升高,热导率有先增大后减小的趋势。

Thermal conductivity of High Temperature Reduced Graphene Oxide Films

Reduced graphene oxide films with dense structures and high flexibility were prepared by oxidation-reduction method.The thermal conductivity of the films before and after reduction at higher annealing temperature was measured by T-Type steady-state method.The effect of reduction temperature on thermal conductivity and mechanical properties of the films was studied.The results show that the reduction at high temperature is beneficial to the removal of oxygen-containing functional groups in graphene oxide and the restoration of sp2 hybrid carbon lattice.And the higher the temperature,the better the reduction effect is.When the reduction temperature is as high as2800℃,the thermal conductivity of graphene film ranges from 336.9 W·m^-1·K^-1 to 436 W·m^-1·K^-1 in the 200 K-350 K temperature range.With the increase of the temperature,the thermal conductivity increases first and then decreases.