| 一种高集成LTCC射频前端电路 |
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| 引用本文： | 柳现发,王绍东,吴洪江,洪求龙.一种高集成LTCC射频前端电路[J].微纳电子技术,2008,45(9). |
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| 作者姓名： | 柳现发 王绍东 吴洪江 洪求龙 |
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| 作者单位： | 中国电子科技集团公司,第十三研究所,石家庄,050051 |
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| 摘 要： | 设计并制作了一种基于LTCC技术的系统级封装多通道射频前端电路。讨论了优化系统结构设计和LTCC材料选择,采用小信号S参数和谐波平衡法进行系统原理仿真设计,用三维电磁场法进行多层LTCC基板微波电路仿真分析。依托先进的LTCC制造工艺技术,该射频前端电路高密度集成了MMIC和CMOS芯片、贴片元件、多种形式的嵌入式滤波器以及控制线、微带线、带状线等元件,实现了微波信号放大、下变频和控制,具有体积小、重量轻、低噪声、低功耗、多通道的特点。该电路性能优良,增益62dB,噪声系数2.8dB,输入驻波比小于1.8,与采用混合集成电路技术的同类产品相比体积大幅度减小。
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| 关 键 词： | 低温共烧陶瓷 射频前端 系统级封装 谐波平衡 微波单片集成电路 |
Highly Integrated LTCC RF Front-End Circuit |
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| Liu Xianfa,Wang Shaodong,Wu Hongjiang,Hong Qiulong.Highly Integrated LTCC RF Front-End Circuit[J].Micronanoelectronic Technology,2008,45(9). |
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| Authors: | Liu Xianfa Wang Shaodong Wu Hongjiang Hong Qiulong |
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| Institution: | Liu Xianfa,Wang Shaodong,Wu Hongjiang,Hong Qiulong(The 13th Researth Institute,CETC,Shijiazhuang 050051,China) |
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| Abstract: | A system in package(SIP) RF front-end based on LTCC technology was designed,fabricated and tested.The optimazaiton of system structure and the selection of LTCC material were discussed.The small signal S parameters were used and the harmonic balance technique was performed in system simulation design,and 3D EM simulator was utilized to analyse the simulation of the microwave circuit based on the multi-layer LTCC substrate.Based on the advanced LTCC manufacturing process technology,MMIC and CMOS chips,lunmpe... |
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| Keywords: | low temperature co-fire ceramic(LTCC) RF front-end system in package(SIP) harmonic balance microwave monolithic integrated circuit(MMIC) |
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