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双润滑铜基粉末冶金滑板载流磨耗试验与分析
引用本文:陈忠华,郭凤仪,董讷.双润滑铜基粉末冶金滑板载流磨耗试验与分析[J].辽宁工程技术大学学报(自然科学版),2007,26(3):391-393.
作者姓名:陈忠华  郭凤仪  董讷
作者单位:辽宁工程技术大学,电气与控制工程学院,辽宁,阜新,123000
基金项目:教育部留学回国人员科研启动基金项目(教外司留5005-383),辽宁工程技术大学优秀青年基金资助项目(04A010013)
摘    要:针对研制的新型滑板进行了载流磨耗试验。室内磨耗试验造成滑板和接触导线磨损的主要原因是粘着磨损,工业运行试验中造成磨损的主要原因是粘着磨损、磨粒磨损和冲击磨损;受电弓滑板与接触导线的磨损是机械作用和强电流作用的综合结果,并相互影响和激化。在铜基滑板中加入固体润滑剂石墨和铅,以及采取外部双侧用高强石墨加强润滑起到了较好的润滑效果;由于粘着磨损和冲击磨损在滑板总磨损中占有相当比重,提高抗粘着性和提高机械强度是减小滑板磨损的有效途径,改善润滑效果是减磨的最有效办法。

关 键 词:滑板  载流磨耗  润滑  性能分析
文章编号:1008-0562(2007)03-0391-03
修稿时间:2006-06-12

Carrying current abrasion experiment and performance analysis of metallurgic slide with double lubricative copper base powder
CHEN Zhong-hua,GUO Feng-yi,DONG Ne.Carrying current abrasion experiment and performance analysis of metallurgic slide with double lubricative copper base powder[J].Journal of Liaoning Technical University (Natural Science Edition),2007,26(3):391-393.
Authors:CHEN Zhong-hua  GUO Feng-yi  DONG Ne
Institution:College of Electronic Engineering, Liaoning Technical University, Fuxin 123000,China
Abstract:The experiments of carrying current abrasion are carried out for the developmental of a new type of slide.The main reason of interior abrasion test resulting in slide and contact wires is adhesive abrasion and the main reasons of industrial operation test resulting in abrasion are adhesive abrasion,abrasive grain abrasion and impact abrasion;Mechanical effect and intense current effect lead to the abrasion of slide and contact wire,influence and intensify each other.By means of the plumbago and the led in the copper base slide,and take measure of high strength plumbago of exterior bilateral to develop to lubricate it,the idea makes a good lubricative effect.Because adhesive abrasion and impact abrasion in the main abrasion of slide take large proportion,the effective measures of reducing slide abrasion raised anti-adhesiveness and mechanical strength.The most effective measure is improving lubricative effect.
Keywords:slide  carrying current abrasion  lubricate  performance analysis
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